Intel confirms Oregon plant will be ready to make 450 mm wafers

Intel’s already boasted of its massive investment in a new 22 nanometer manufacturing process , and it’s now confirmed that it’s new plant in Hillsboro, Oregon, dubbed D1X will be ready to produce 450 millimeter wafers. Of course, “ready” seems to be the keyword here — Intel will apparently stick with 300 mm wafers for a while yet, but have all the necessary preparations put in place to kick start 450 mm production when the industry is ready for it. That shift promises to both increase efficiency and cut costs by allowing more chips to be produced at a time, but it will likely still be years before we see any actual results — one analyst speculates it could be 2018 at the earliest before 450 mm fabrication tools are ready. Intel confirms Oregon plant will be ready to make 450 mm wafers originally appeared on Engadget on Thu, 09 Dec 2010 16:33:00 EDT. Please see our terms for use of feeds . Permalink

Posted by on December 9, 2010. Filed under News, Tech. You can follow any responses to this entry through the RSS 2.0. You can leave a response or trackback to this entry